Hardware

Design of electronic circuits and printed circuit boards

We have extensive experience in design electronic circuits and printed circuit boards.

Modern design and modeling tools allow us to quickly and efficiently solve any problem.

Design of circuits and boards is carried out taking into account all modern standards of reliability and safety.


Tasks that we solve:

  • Design of multilayer printed circuit boards of various structures (hard, flexible, microwave)

  • Design of boards with high-speed and wireless interfaces

  • Used CPU and SoC: Marvell, Broadcom, Freescale, Atmel with architectures ArmV7, ArmV8, Cortex-A, ARM7, ARM9, MIPS

  • Used SoM of NVIDIA: Xavier, Jetson TX2, Jetson TX1, NanoBoard

  • Used microcontrollers: Atmel, ST, Microchip, NXP with architecture Cortex-M, AVR, PIC

  • Used FPGA and CPLD: Xilinx, Altera and Lattice

  • Memory with serial and parallel interfaces: SDRAM, DDR, DDR2, DDR3, Flash NAND and NOR

  • Digital and analog circuits: DAC, ADC, amplifiers, filters

  • Wired data transfer protocols: 1G Ethernet, USB2.0, USB3.0, USB type-C, PCI, PCI Express (Gen 1,2,3,4), SATA, SFP, I2C, SPI, UART, KNX, RS-232, RS-485, MILD-1533

  • Wireless data transfer protocols: Wi-Fi (802.11 n, 802.11 ac), Bluetooth, GSM, GPRS, 3G, LTE, NFC, RFID, Sub-1 GHz

  • Video protocols: LVDS, MIPI CSI-2, MIPI DSI, HDMI, RGB

  • Audio protocols: AC ‘ 97, I2S

  • Power supply: AC-DC, DC-DC, PoE, battery supply and battery charging circuits


Design tools:

  • CAD for electronics design: Altium Designer, PADS, OrCad, PCAD, KiCAD, Eagle

  • CAD for mechanical design : SolidWorks

  • CAD for modeling: HyperLynx, Sigrity, AWR


Examples

Optical positioning device

Key parameters:

  • SoC – CPU MIPS32 and DSP
  • FPGA – Altera EPF10K50
  • Image Sensor – Cypress STAR1000 1M Pixel Radiation Hard CMOS
  • Power supply – DC/DC 27V 0.5A
  • Stackup – 6 layers, 2 layers is flexible
  • PCB – 300+ components, 1500+ pads, 1000+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Design of firmware for CPU and FPGA
  • Design of the testing program


Duplicated data processing unit from the optical positioning devices

Key parameters:

  • SoC – CPU MIPS32 and DSP
  • RAM – 3D Pluse SRAM 4Mb
  • FPGA – Altera EPF10K50
  • Power supply – DC/DC 27V 1A
  • Stackup – 6 layeres, 2 layers is flexible
  • PCB – 450+ components, 2500+ pads, 1600+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Design of firmware for FPGA and CPU, without a positioning algorithms

Wi-Fi outdoor base station IEEE802.11ac

Key parameters:

  • CPU – Marvell 88F6820
  • RAM – DDR3 128Mb
  • Mini PCI or PCI Express mini for wireless cards
  • Gigabit Ethernet.
  • SFP for fiber modules
  • PoE++ up to 60W
  • Stackup – 8 layeres
  • PCB – 1500+ components, 5000+ pads, 6000+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Porting of the OpenWRT

Wi-Fi outdoor abonent station IEEE802.11ac

Key parameters:

  • CPU – Broadcom BCM53015A1
  • RAM – DDR3 64Mb
  • Wireless – Atheros QCA9898 IEEE 802.11ac 256-QAM
  • Output power up to 24dB
  • Gigabit Ethernet
  • PoE+ 25W. Input voltage from 9V to 60V for different power supplys
  • Stackup – 6 layeres
  • PCB – 1000+ components, 3000+ pads, 4500+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Porting of the OpenWRT


Control board for medical devices: spirometry, mechanical ventilation, ECG

Key parameters:

  • CPU – ARM9 Atmel AT91SAM9G45
  • RAM – DDR2 128Mb
  • Gigabit Ethernet
  • Cенсорный экран 800х600
  • Power supply – DC/DC 5V 1A.
  • Stackup – 8 layers
  • PCB – 500+ components, 1500+ pads, 2000+ vias.

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Design of firmware
  • Porting Linux 3.12 used BuildRoot
  • Design software using libraries Qt


Carrier board of the SoM NVIDIA Xavier

Key parameters:

  • SoM – NVIDIA Xavier
  • 3 x USB 3.1
  • 1 x USB 2.0
  • 2 x Ethernet
  • 4 x MIPI CSI-2
  • 1 x PCIe-to-SATA
  • 1 x HDMI
  • 1 x M.2 (SATA and PCIEx4)
  • 1 x PCI Express x 8
  • 1 x SLVS for Sony image sensors
  • GPIO, SPI, I2C ports
  • Power supply DC 19V, 200W
  • Stackup – 10 layers
  • PCB – 1200+ components, 4300+ pads, 3800+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Porting Linux and developing drivers


Carrier board of the SoM NVIDIA NanoBoard and Xavier NX

Key parameters:

  • SoM – NVIDIA NanoBoard or Xavier NX
  • 1 x USB 3.0
  • 2 x USB 2.0
  • 2 x Ethernet
  • 2 x MIPI CSI-2
  • 1 x HDMI
  • 1 x MIPI DSI
  • 1 x PCIe-to-SATA
  • Power supply 19V 50W
  • Stackup – 6 layers
  • PCB – 600+ components, 2000+ pads, 1600+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Porting Linux and developing drivers


Carrier board of the SoM NVIDIA Jetson TX2

Key parameters:

  • SoM – Nvidia Jetson TX2
  • 2 x USB 3.1
  • 4 x USB 2.0
  • 2 x Ethernet
  • 3 x MIPI CSI-2
  • 1 x SATA
  • 1 x HDMI
  • GPIO, SPI, I2C ports
  • Stackup – 6 layers
  • PCB – 600+ components, 2000+ pads, 1300+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Porting Linux and developing drivers


Carrier board of the NVIDIA Jetson TX1 (TX2) for security camera 360 degree

Key parameters:

  • SoM – Nvidia Jetson TX1 or TX2
  • Image Sensor – 2 x Sony IMX172
  • 1 x USB 2.0
  • 1G Ethernet
  • 2 x MIPI CSI-2
  • 1 x HDMI
  • Релейный Output
  • Optocupler in
  • Power supply PoE+ 25W
  • Stackup – 6 layers
  • PCB – 500+ components, 2000+ pads, 2500+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Porting Linux and developing drivers


Carrier board of the NVIDIA Jetson TX1 (TX2) for the automotive camera 360 degree

Key parameters:

  • SoM – Nvidia Jetson TX1 or TX2
  • Image Sensor – 2 x Sony IMX172
  • 1 x USB 2.0
  • 1G Ethernet
  • 2 x MIPI CSI-2
  • 1 x HDMI
  • Power supply from the car network 12-24V 25W
  • Stackup – 6 layers
  • PCB – 500+ components, 2000+ pads, 2500+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Porting Linux and developing drivers


Carrier board of the SoM NVIDIA Jetson TX1 (TX2)

Key parameters:

  • SoM – Nvidia Jetson TX1 or TX2
  • 2 x USB 3.0
  • 2 x USB 2.0
  • 6 x MIPI CSI-2
  • 1 x HDMI
  • Stackup – 6 layers
  • PCB – 250+ components, 1200+ pads, 500+ vias

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples

Sensor board Sony IMX283 MIPI CSI-2

Key parameters:

  • Image sensor – Sony IMX283
  • Diagonal 15.86 mm
  • 5592 (H) × 3710 (V) 20.75 M pixels
  • Stackup – 4 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Linux driver development

Sensor board Sony IMX415 MIPI CSI-2

Key parameters:

  • Image sensor – Sony IMX415
  • Diagonal 6.4 mm
  • 3864 (h) x 2228 (V) 8.6 M pixels
  • Stackup – 4 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Linux driver development

Sensor board Sony IMX335 MIPI CSI-2

Key parameters:

  • Image sensor – Sony IMX335
  • Diagonal 6.52 mm
  • 2704 (h) x 2104 (V) 5.69 M pixels
  • Stackup – 4 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Linux driver development


Sensor board Sony IMX172 with the bridge LVDS to MIPI CSI-2

Key parameters:

  • Image sensor – Sony IMX172
  • FPGA – Lattice MachXO2
  • 4072 (H) × 3046 (V) 12.4 M pixels
  • Stackup – 6 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Разработка прошивки FPGA LVDS-to-MIPI CSI2
  • Linux driver development


Video bridge MIPI CSI-2 to USB3.1 (type-C)

Key parameters:

  • Cypress EZ-USB® CX3
  • Stackup – 4 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


USB to Ethernet bridge for camera Allie-Home с POE+ 25W

Key parameters:

  • Bridge – Microchip LAN7500
  • Interfaces – Ethernet 100Mb, USB2.0
  • Power supply PoE+ 25W
  • Stackup – 4 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Linux driver development


Radio-controlled thyristor module for load 220V

Key parameters:

  • MCU – STM32L100
  • Wireless – TI CC120 SubGHz
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


Radio-controlled intercom with control electrical lock unit for mini hotels

Key parameters:

  • MCU – nRF52832 (BlueTooth)
  • Battery supply 3 х 18650
  • LiPo charger 3 х 18650
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


RFID key reader for mini hotels with noise detection microphone

Key parameters:

  • MCU – nRF52832
  • Battery supply 2 x AA
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


GSM modems with different interfaces – USB, RS-485, RS-232

Key parameters:

  • SimCom – Sim900
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Development of a software for configuration and testing


GSM / GPRS modem for mobile ECG

Key parameters:

  • ST – STM32L100
  • SIMCOM – Sim900
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Разработка прошивки управления
  • Development of a software for control of device


Stm32 automation controller

Key parameters:

  • MCU – STM32F4
  • Ethernet
  • GPIO, SPI, I2C ports

Our part of job:

  • Design of Circuit and PCB
  • Development of a firmware for control of device


Low frequency noise generator

Key parameters:

  • MCU – STM32F4
  • Power Meanwell IRM-15-12
  • Ethernet

Our part of job:

  • Design of Circuit and PCB


Amplification and processing board for low-frequency analog signals

Key parameters:

  • MCU – STM32F3
  • USB 2.0
  • Stackup – 4 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Development of a firmware for control of device
  • Development of a software for configuration and testing


Device of spirometry monitor

Key parameters:

  • MCU – STM32F3
  • Stackup – 4 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Development of a firmware for control of device
  • Development of a software for configuration and testing


Power supply AC/DC 90V – 220V 10W

Key parameters:

  • Input – AC 90V – 230V
  • Output – DC 5V – 12V
  • Insulation – 1.5кВ
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


Power supply AC/DC 90V – 220V 20W

Key parameters:

  • Input – AC 90V – 230V
  • Output – DC 5V – 12V
  • Insulation – 1.5кВ
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


Power supply DC/DC 10V – 60V 25W with POE+

Key parameters:

  • Input – DC 10V – 60V
  • Output – DC 5V
  • Insulation – 1.5кВ
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


Power supply AC/DC 90V – 230V 50W, Insulation 5kV

Key parameters:

  • Input – AC 90V – 230V
  • Output – DC 12V
  • Insulation – 5кВ
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


Power supply AC/DC 90V – 230V 20W, USB type-C

Key parameters:

  • Input – AC 90V – 230V
  • Output – 5V USB type-C
  • Insulation – 1.5кВ
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


KNX TP2 thyristor module for load 220V

Key parameters:

  • MCU – STM32L100
  • Protocol – KNX TP2
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


KNX TP2 transistor module for load DC 5-24 V

Key parameters:

  • MCU – STM32L100
  • Protocol – KNX TP2
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples


USB – KNX TP2 bridge with insulation

Key parameters:

  • Bridge – ON Semi NCN5120
  • Interfaces – KNX TP and USB2.0
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Development of a software for configuration and testing


USB – TTL UART/RS-232/RS-485 bridge

Key parameters:

  • Bridge – Silabs CP210
  • Interfaces – USB2.0, UART, RS-232, RS-485
  • Stackup – 2 layers

Our part of job:

  • Design of Circuit and PCB
  • Production and testing of samples
  • Development of a software for configuration and testing